Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma
| Autoři | |
|---|---|
| Rok publikování | 2015 |
| Druh | Článek v odborném periodiku |
| Časopis / Zdroj | International Journal of Nanomanufacturing |
| Fakulta / Pracoviště MU | |
| Citace | |
| www | http://www.inderscience.com/info/inarticle.php?artid=75226 |
| Doi | http://dx.doi.org/10.1504/IJNM.2015.075226 |
| Obor | Fyzika plazmatu a výboje v plynech |
| Klíčová slova | nano-modification;silicon wafer;surface treatment;diffuse plasma;DBD |
| Popis | In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces. |
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