Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma

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Authors

HOMOLA Tomáš PRYSIAZHNYI Vadym STUPAVSKÁ Monika

Year of publication 2015
Type Article in Periodical
Magazine / Source International Journal of Nanomanufacturing
MU Faculty or unit

Faculty of Science

Citation
Web http://www.inderscience.com/info/inarticle.php?artid=75226
Doi http://dx.doi.org/10.1504/IJNM.2015.075226
Field Plasma physics
Keywords nano-modification;silicon wafer;surface treatment;diffuse plasma;DBD
Description In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.
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