ELECTRON MICROSCOPY OF NANOPARTICLES FOR LEAD-FREE SOLDERING PREPARED BY WET CHEMICAL SYNTHESIS
| Authors | |
|---|---|
| Year of publication | 2011 |
| Type | Article in Proceedings |
| Conference | NANOCON 2011 |
| MU Faculty or unit | |
| Citation | |
| Web | http://nanocon2014.tanger.cz/files/proceedings/nanocon_11/lists/papers/1114.pdf |
| Keywords | solder; nanopowder; electron microscopy |
| Description | The nanoparticles of pure metals and alloys exhibit the depression of the melting point compared to bulk material, hence they are able to aggregate and to form firm interlayer joints at low temperatures. Exploiting this effect in soldering industry can save energy, work and materials. Using emulsions with nanopowders might be the solution of demanding task of replacing classical Sn-Pb solders by their lead-free substitutes. In this work, Ag- and Sn-based nanopowders were prepared as potential low-toxic constituents of novel solders by a chemical wet synthesis from chemicals of high purity. Various ways of preparation and further storage of the product were examined. Resulting nanoparticles (their size distribution, morphology and tendency for clustering) were characterized by means of scanning and transmission electron microscopy. |
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