Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
| Authors | |
|---|---|
| Year of publication | 2010 |
| Type | Article in Proceedings |
| Conference | TechConnect WORLD Conference & Expo 2010 |
| MU Faculty or unit | |
| Citation | |
| Web | Nanotech 2010 (Anaheim CA) |
| Field | Physical chemistry and theoretical chemistry |
| Keywords | Soldering nanopowder substrate characterisation |
| Attached files | |
| Description | Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. |
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