Behaviour of Hybrid PVD-PECVD Process in Comparison with Conventional Reactive Magnetron Sputtering

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Authors

SCHMIDTOVÁ Tereza VAŠINA Petr

Year of publication 2010
Type Article in Proceedings
Conference 7th ICRP & 63rd GEC - CONFERENCE PROCEEDINGS
MU Faculty or unit

Faculty of Science

Citation
Field Plasma physics
Keywords hybrid PVD-PECVD process; magnetron sputtering; hysteresis; OES
Description Hybrid PVD-PECVD sputtering process was studied in comparison with conventional reactive magnetron sputtering. Titanium target was sputtered in argon plus oxygen atmosphere for conventional reactive sputtering and in argon plus acetylene for hybrid process. The hybrid PVD-PECVD combines aspects of both processes: conventional sputtering of metal target but source of carbon was hydrocarbon vapour. We report differences in behaviour of these two processes, discuss necessary time for hybrid process to achieve steady state conditions and suggest modification of Berg's model for reactive magnetron sputtering to predict behaviour of hybrid process.
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